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Characteristics of
eutectic solder
Solder designed with consideration for the environment and human health.
Composition | Sn Cu 0.7% Ni 0.05% +Ge(≦0.01%) |
Melting
point |
227℃ |
The lead-free eutectic solder with excellent solderability and reliability.
Composition | Sn Ag 3.0% Cu 0.5% |
Melting
point |
217 to 220℃ |
The lead-free solder recommended by*JEITA, widely used in manufacturing fields.
*Japan Electronics and Information Technology Industries Association
This tortoise-shell "Kikko" pattern is HAKKO's trademark that indicates lead-free solder.
Composition | Sn Pb 37% |
Melting
point |
183℃ |
The leaded eutectic solder with low melting point, excellent solderability, and reliability, ideal for beginners.
Composition | Sn Pb 50% |
Melting
point |
183 to 215℃ |
A solder recommended for sheet metal work and metalworking due to its melting point range.
This lattice "Kagome" pattern is HAKKO's trademark that indicates leaded solder.
Pick the right size for the application.
Series | Alloy Type | Composition / Melting point | Φ0.3 mm | Φ0.6 mm | Φ0.8 mm | Φ1.0 mm | Φ1.2 mm | Φ1.6 mm |
---|---|---|---|---|---|---|---|---|
FS-511 | Lead-free | Sn Cu 0.7% Ni 0.05% +Ge(≦0.01 %) ・ 227℃(Eutectic) |
〇 | 〇 | 〇 | 〇 | 〇 | 〇 |
FS-521 | Lead-free | Sn Ag 3.0% Cu 0.5% ・ 217 to 220℃ |
〇 | 〇 | 〇 | 〇 | 〇 | 〇 |
FS-311 | Leaded | Sn Pb 37% ・ 183℃(Eutectic) |
〇 | 〇 | 〇 | 〇 | 〇 | 〇 |
FS-321 | Leaded | Sn Pb 50% ・ 183 to 215℃ |
― | ― | ― | ― | 〇 | 〇 |
The waste-free 1 m rolls allow for choosing the right solder, size, and quantity.
The use of no-clean flux with low corrosive properties does not require cleaning of the residue after soldering.